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| Interface optimization of graphene paper–Cu composite prepared by electrodeposition |
| Jing Guo1, Hai-jing Wang2, Shuang-juan Liu3, Peng Zhang2, Jing-yu Tang4, Wei-yang Zhang1, Han-jie Guo1, Peng-cheng Wang2, Cai Meng2 |
1 School of Metallurgical and Ecological Engineering, University of Science and Technology Beijing, Beijing 100083, China
2 Institute of High Energy Physics, Chinese Academy of Sciences, Beijing 100049, China
3 Advanced Technology and Materials Co., Ltd., Beijing 100083, China
4 School of Nuclear Science and Technology, University of Science and Technology of China, Hefei 230027, Anhui, China |
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Abstract A room-temperature electrodeposition method with an organic electrolyte was developed to fabricate a HNO3-pretreated graphene paper Cu (GP′–Cu) composite. To improve the interfacial bonding of GP′–Cu composite, magnetron sputtering technology was used to create a ‘‘sandwich’’ structural gradient GP′–Cu composite. The selection of the intermediate transition layer metal was based on two-dimensional disregistry. Scanning electron microscopy, X-ray photoelectron spectroscopy, and other analytical methods confirmed that the addition of an intermediate transition metal (Cr, Ni) layer reduced the gap distance and enhanced the interfacial bonding of the GP′ and Cu deposited layers. The GP′–Ni–Cu composite exhibited the largest increase in tensile strength and conductivity. In addition, it had the highest thermal diffusivity and elongation at break among the GP′–Cu, GP′–Cr–Cu and GP′–Ni–Cu composites.
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Received: 01 August 2023
Published: 25 January 2024
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| Cite this article: |
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Jing Guo,Hai-jing Wang,Shuang-juan Liu, et al. Interface optimization of graphene paper–Cu composite prepared by electrodeposition[J]. Journal of Iron and Steel Research International, 2024, 31(1): 64-73.
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2024, Vol. 31 
