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  2018, Vol. 37 Issue (03): 25-30    DOI: 10.13228/j.boyuan.issn1005-4006.20180025
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Study on effective thermal conductivity of solid slag film for mold flux under steady state heat conduction
ZHU Xian-fei,WEN Guang-hua,PU Da-zhi,TANG Ping,FU Da-chao
(College of material science and engineering, Chongqing University, Chongqing 400044, China)

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