Abstract��Scale deposit has great effect on heat conduction ability of mold copper plate. Deposition on cooling side of mold was analyzed by means of SEM and diffraction instrument in laboratory, and we discovered main element in deposition, such as oxygen, copper, iron, nickel etc. It was non-uniform on the surface of copper plate and had obvious difference of thickness, combined compactly with copper plate. In order to prevent existence of deposition, requirement of water quality should be observed strictly during production, and the substance having suitable properties used to prevent deposition and corrosion should be added into cooling water. |