Microstructure and shear properties evolution of Mn-doped SAC solder joint under isothermal aging
Cheng-ming Li, Shu-jin Chen, Shan-shan Cai, Ju-bo Peng, Xiao-jing Wang, Ying-wu Wang
钢铁研究学报(英文版) ›› 2023, Vol. 30 ›› Issue (8) : 1650-1660.
Microstructure and shear properties evolution of Mn-doped SAC solder joint under isothermal aging
Microstructure and shear properties evolution of Mn-doped SAC solder joint under isothermal aging
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