Microstructure and shear properties evolution of Mn-doped SAC solder joint under isothermal aging

Cheng-ming Li, Shu-jin Chen, Shan-shan Cai, Ju-bo Peng, Xiao-jing Wang, Ying-wu Wang

钢铁研究学报(英文版) ›› 2023, Vol. 30 ›› Issue (8) : 1650-1660.

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钢铁研究学报(英文版) ›› 2023, Vol. 30 ›› Issue (8) : 1650-1660. DOI: 10.1007/s42243-023-01027-y
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Microstructure and shear properties evolution of Mn-doped SAC solder joint under isothermal aging

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Microstructure and shear properties evolution of Mn-doped SAC solder joint under isothermal aging

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{{article.zuoZheCn_L}}. {{article.title_cn}}[J]. {{journal.qiKanMingCheng_CN}}, 2023, 30(8): 1650-1660 https://doi.org/10.1007/s42243-023-01027-y
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 30(8): 1650-1660 https://doi.org/10.1007/s42243-023-01027-y
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