Microstructural evolution and bonding characteristics of Ag/Cu interface in Ag/Cu bimetallic strips fabricated via diffusion welding

Zong-ye Ding, Yong-tao Jiu, Wei-min Long, Su-juan Zhong, Jiang-tao Hou, Xiao-fei Ren, Jian-chang Zhao, Guan-xing Zhang, Shi-zhong Wei

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钢铁研究学报（英文版） ›› 2025, Vol. 32 ›› Issue (6) : 1468-1476. DOI: 10.1007/s42243-024-01383-3

Microstructural evolution and bonding characteristics of Ag/Cu interface in Ag/Cu bimetallic strips fabricated via diffusion welding

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Microstructural evolution and bonding characteristics of Ag/Cu interface in Ag/Cu bimetallic strips fabricated via diffusion welding

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{{article.zuoZheCn_L}}. {{article.title_cn}}[J]. {{journal.qiKanMingCheng_CN}}, 2025, 32(6): 1468-1476 https://doi.org/10.1007/s42243-024-01383-3

{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2025, 32(6): 1468-1476 https://doi.org/10.1007/s42243-024-01383-3

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