Preparation and properties of low temperature curing resin-based conductive copper paste

Through magnetic stirring and low-temperature curing,two types of resin-based cured conductive copper pastes were fabricated using phenolic resin and epoxy resin as matrices with copper powder as conductive filler. The effects of curing parameters and copper powder content on their electrical conductivity were systematically investigated. Experimental results demonstrate that the optimal curing conditions for phenolic resin-based copper paste（PF-Cu） and epoxy resin-based copper paste（EP-Cu） are 180 ℃ for 60 min and 250 ℃ for 150 min,respectively,achieving resistivities of 11. 4 × 10^-4Ω·cm and 2. 14 × 10^-4Ω·cm. Due to its higher curing shrinkage,copper powder content significantly influences the electrical conductivity,with EP-Cu exhibiting superior conductivity. When the mass fraction of copper powder is 70%,the resistivity is 2. 18 × 10^-3Ω·cm. Microstructural analysis reveals that EP-Cu facilitates tighter copper particle contacts through curing-induced shrinkage,forming stable conductive pathways. This study provides theoretical and experimental foundations for developing cost-effective,high-performance conductive pastes with low-temperature processing requirements.