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Thermal and Mechanical Couple Stress Analysis of Mould Copper for Slab Continuous Casting |
DUAN Mingnan1,FENG Changbao2,YANG Jianhua2,YUAN Wei2,YANG Ke2 |
1. Baosteel ,Research Institute, Shanghai 201900, China;2. Baosteel, SteelMaking Plant, Shanghai 201900, China |
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Abstract With thermocouples set on the back of mold copperplate, the temperature distribution was measured.Considering the change of physical parameters of liquid steel,strand,copper and media on interface with temperature, the dynamic temperature field and couplestress of mould copper in range of threerow thermocouples were simulated by FEA soft ANSYS. The results provided a good reference for copper stress distribution and defect analysis.
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Received: 01 January 1900
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