1 School of Materials Science and Engineering, Jiangsu University, Zhenjiang 212013, Jiangsu, China 2 Yangtze Delta Region Institute of Advanced Materials, Suzhou 215100, Jiangsu, China 3 State Key Laboratory of Advanced Metals and Materials, University of Science and Technology Beijing, Beijing 100083, China
Temperature dependence in tensile properties and deformation behavior of GH4169 alloy
1 School of Materials Science and Engineering, Jiangsu University, Zhenjiang 212013, Jiangsu, China 2 Yangtze Delta Region Institute of Advanced Materials, Suzhou 215100, Jiangsu, China 3 State Key Laboratory of Advanced Metals and Materials, University of Science and Technology Beijing, Beijing 100083, China
摘要 The effect of temperature on the tensile properties and deformation mechanism of GH4169 alloy has been systematically studied over a wide range of room temperature (RT) to 1000 C. The results indicate that the stress–strain curve of the alloy shows serrations at 200–600 C, and the character of the serrations changes from type A to type B and then to type C at different temperatures. The ultimate tensile strength of the alloy decreases gradually from RT to 600 C. The yield strength decreases slowly from RT to 700 C but decreases rapidly above 800 C. Transmission electron microscopy analysis relieves that the primary deformation mechanism of the alloy below 500 C is Orowan bypass mechanism. At temperatures between 600 and 700 C, the coordinated deformation of twins and cross-slip of dislocations are activated. The transformation of c00 phase to d phase above 650 C will decrease the strength. The primary deformation mechanism above 800 C transforms into the repeated shearing of c00 by dislocations to form multiple stacking faults. Recrystallized grains were observed above 800 C, and continuous dynamic recrystallization and discontinuous dynamic recrystallization were observed. The stress concentration caused by Nb-rich carbides is the cause of intracrystalline crack nucleation. At 700 C, grain boundary crack sprouting is caused by the combined effect of slip band impact on grain boundaries and grain boundary dislocation plugging. The relationship between the serrated flow behavior and the deformation mechanism has been discussed based on the experimental results.
Abstract：The effect of temperature on the tensile properties and deformation mechanism of GH4169 alloy has been systematically studied over a wide range of room temperature (RT) to 1000 C. The results indicate that the stress–strain curve of the alloy shows serrations at 200–600 C, and the character of the serrations changes from type A to type B and then to type C at different temperatures. The ultimate tensile strength of the alloy decreases gradually from RT to 600 C. The yield strength decreases slowly from RT to 700 C but decreases rapidly above 800 C. Transmission electron microscopy analysis relieves that the primary deformation mechanism of the alloy below 500 C is Orowan bypass mechanism. At temperatures between 600 and 700 C, the coordinated deformation of twins and cross-slip of dislocations are activated. The transformation of c00 phase to d phase above 650 C will decrease the strength. The primary deformation mechanism above 800 C transforms into the repeated shearing of c00 by dislocations to form multiple stacking faults. Recrystallized grains were observed above 800 C, and continuous dynamic recrystallization and discontinuous dynamic recrystallization were observed. The stress concentration caused by Nb-rich carbides is the cause of intracrystalline crack nucleation. At 700 C, grain boundary crack sprouting is caused by the combined effect of slip band impact on grain boundaries and grain boundary dislocation plugging. The relationship between the serrated flow behavior and the deformation mechanism has been discussed based on the experimental results.
Qi Zheng,Tian Liu,Jia-bo Wei, et al. Temperature dependence in tensile properties and deformation behavior of GH4169 alloy[J]. Journal of Iron and Steel Research International, 2023, 30(12): 2566-2581.
2023, Vol. 30 
