Microstructural evolution and bonding characteristics of Ag/Cu interface in Ag/Cu bimetallic strips fabricated via diffusion welding
Zong-ye Ding, Yong-tao Jiu, Wei-min Long, Su-juan Zhong, Jiang-tao Hou, Xiao-fei Ren, Jian-chang Zhao, Guan-xing Zhang, Shi-zhong Wei
Microstructural evolution and bonding characteristics of Ag/Cu interface in Ag/Cu bimetallic strips fabricated via diffusion welding
Zong-ye Ding, Yong-tao Jiu, Wei-min Long, Su-juan Zhong, Jiang-tao Hou, Xiao-fei Ren, Jian-chang Zhao, Guan-xing Zhang, Shi-zhong Wei
钢铁研究学报（英文版）
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2025, (6): 1468
-1476
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DOI: 10.1007/s42243-024-01383-3
