Effect of trace Zn addition on electromigration of Cu/Sn–10Bi/Cu solder joints

Jia-yu Zhang, Feng-jiang Wang, Yan-xin Qiao

Journal of Iron and Steel Research International ›› 2024, Vol. 31 ›› Issue (10) : 2568-2576.

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Journal of Iron and Steel Research International ›› 2024, Vol. 31 ›› Issue (10) : 2568-2576. DOI: 10.1007/s42243-024-01301-7
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Effect of trace Zn addition on electromigration of Cu/Sn–10Bi/Cu solder joints

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 31(10): 2568-2576 https://doi.org/10.1007/s42243-024-01301-7

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