Characterization of mechanical properties of through silicon vias-copper nanoindentation with different diameter

ZHANG Zhuohao, QIN Fei, WU Daowei, LI Kui, DAI Yanwei

Physics Examination and Testing ›› 2025, Vol. 43 ›› Issue (6) : 78-82.

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Physics Examination and Testing ›› 2025, Vol. 43 ›› Issue (6) : 78-82. DOI: 10.13228/j.boyuan.issn1001-0777.20250076

Characterization of mechanical properties of through silicon vias-copper nanoindentation with different diameter

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2025, 43(6): 78-82 https://doi.org/10.13228/j.boyuan.issn1001-0777.20250076

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