Dynamics simulation and interface evolution of copper-tin flyer plate in electromagnetic pulse welding

LI Xin, ZHANG Long, MA Zichao, GAO Lei, YIN Limeng

Physics Examination and Testing ›› 2026, Vol. 44 ›› Issue (1) : 8-14.

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Physics Examination and Testing ›› 2026, Vol. 44 ›› Issue (1) : 8-14. DOI: 10.13228/j.boyuan.issn1001-0777.20250098
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Dynamics simulation and interface evolution of copper-tin flyer plate in electromagnetic pulse welding

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2026, 44(1): 8-14 https://doi.org/10.13228/j.boyuan.issn1001-0777.20250098

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