中厚板生产过程中采用中间冷却（IC）工艺可以增加待温过程的冷却速率，提高轧制效率。采用有限元方法分析了中间坯待温过程的温度场变化，结果表明：通过中间冷却结合40～60s的空冷返红时间，冷却效果与完全空冷基本相同；通过热模拟试验的方法研究了中间冷却过程中的晶粒尺寸的变化规律，分析了中厚板冷却过程中晶粒长大的控制方法，将中间冷却工艺应用于国内某中板生产线，有效提高了生产效率，改善了表面质量并能降低合金成分的添加量。

Interstand cooling(IC) is widely used in plate rolling because it can improve the cooling efficiency and rolling rhythm. The temperature field was analyzed by finite element method. The result shows that the effect of the complete air cooling and combination of 40-60s air cooling after enhanced water cooling are roughly equal. The variation of grain size during IC was researched and the grain growth control method of plate rolling was analyzed. It shows that rolling efficiency can be improved and the amount of alloy can also be reduced by the application of IC.