Numerical simulation of actual temperature field for chamfered mold copper

REN Fei-fei，ZHANG Hui，WANG Wei-ning，WANG Ming-lin

Iron and Steel ›› 2015, Vol. 50 ›› Issue (4) : 27-33.

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Iron and Steel ›› 2015, Vol. 50 ›› Issue (4) : 27-33. DOI: 10.13228/j.boyuan.issn0449-749x.20140485

Numerical simulation of actual temperature field for chamfered mold copper

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2015, 50(4): 27-33 https://doi.org/10.13228/j.boyuan.issn0449-749x.20140485

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Started in 1954 (Monthly)
ISSN 0449-749X　CN 11-2118/TF
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