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异质结电池电极银浆用亚微米级球形银粉的制备

Preparation of submicron spherical silver powder for silver paste of heterojunction battery electrode

  • 摘要: 采用液相化学还原法,以DEA用量作为控制银颗粒“成核—生长”速率的旋钮器,使用对苯二酚和抗坏血酸一锅法还原硝酸银制备出亚微米级球形银粉。研究了DEA用量对银粉性能的影响,在DEA添加量为硝酸银质量的50%时,可以制得平均粒径D50为0.49 μm,比表面积2.3 m2/g,松装密度1.7 g/cm3,烧损率0.35%的亚微米级球形银粉。通过X射线衍射(XRD)和SEM表征分析发现,银粉纯度高,结晶性好,颗粒呈高分散性。将所得银粉按配方调制成银浆后,测得黏度为38 Pa·S/25 ℃,经丝网印刷和低温固化后,观察发现线条较为致密,边缘线条平整,测得200 ℃固化膜的电阻率为8.70×10-6 Ω·m。

     

    Abstract: With the amount of DEA as the knob to control the nucleation-growth rate of silver particles the high performance submicron spherical silver powder was prepared using hydroquinone and ascorbic acid to reduce silver nitrate by liquid chemical reduction method. The effect of DEA content on the properties of silver powder was studied. When the DEA content is 50% of the mass of silver nitrate, submicron spherical silver powder with average particle size D50 of 0.49 μm, specific surface area of 2.3 m2/g, apparent density of 1.7 g/cm3 and burning loss of 0.35% could be obtained. By X-ray diffraction (XRD) and SEM analysis, silver powder has high purity, good crystallinity and high dispersion. After the silver powder is prepared into silver paste according to the formula, the measured viscosity is 38 Pa·S/25 ℃, after screen printing and low temperature curing. It is found that the lines are relatively dense and the edge lines are flat. The resistivity of the film cured at 200 ℃ is 8.70×10-6 Ω·m.

     

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