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热等静压对MIM 4J29合金封装外壳组织和性能的影响

Effects of hot isostatic pressing on the microstructures and properties of MIM 4J29 alloy housing for electronic packaging

  • 摘要: 将MIM成形的4J29合金进行了不同温度的热等静压(HIP)后处理,研究了HIP温度对4J29合金微观组织、热膨胀性能和拉伸性能的影响。结果表明:合金随着HIP温度升高致密度逐渐提升,但在1 200 ℃之后,致密度提升速率减缓,硬度逐渐降低,晶粒尺寸增长速率变快;漏气率呈先降低后上升的趋势,在1 200 ℃之前随着温度升高减小,1 200 ℃时漏气率最低,温度继续升高时,漏气率逐渐增大。最佳HIP温度为1 200 ℃,此时合金的密度达到98.54%,漏气率为1.2×10-9 Pa·(m3/s),硬度为81.3HRB,平均膨胀率为(30~200 ℃)2.0×10-6 m·℃,拉伸强度和伸长率均明显提升。

     

    Abstract: The 4J29 alloy formed by MIM underwent post-treatment through Hot Isostatic Pressing(HIP)at various temperatures. The study is aimed to explore how HIP temperature influences the microstructure, coefficient thermal expansion and tensile behavior of the 4J29 alloy. The results reveal a gradual increase in alloy density with rising HIP temperature. However, beyond 1 200 ℃, the density enhancement rate decelerates, hardness decreases, and grain size exhibits accelerated growth. The leak rate follows a trend of initial decrease, reaching its minimum at 1 200 ℃, and then increasing. Before 1 200 ℃, the leak rate decreases with temperature, and beyond 1 200 ℃, it gradually rises. The optimum HIP temperature is 1 200 ℃, resulting in the alloy reaching a density of 98.54%, a leak rate of 1.2×10-9 Pa·(m3/s), hardness of 81.3HRB, an average thermal expansion rate of 2.0×10-6 m·℃ between 30~200 ℃ and along with a noticeable enhancement in tensile strength and elongation.

     

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