Abstract: 【Objective】 Due to its excellent processability, high electrical conductivity, and superior thermal conductivity, pure Cu is widely used in modern industrial applications, such as microelectronics components, integrated circuit lead frames, and motor windings. However, the performance of pure Cu has reached its theoretical limit, making it difficult to meet the growing demands of advanced industrial applications. In recent years, graphene has been considered as a promising reinforcement due to its outstanding intrinsic mechanical strength, electrical and thermal properties, and chemical stability. Therefore, this review aims to systematically summarize recent advancements in in-situ growth strategies for graphene on copper substrates, with a focus on processing routes, architecture design, and the resulting performance of graphene/Cu composites. Special attention is given to analyzing the interface characteristics and their role in determining the overall properties of the composites.【Method】 This review performs a comprehensive analysis of the state-of-the-art research on fabricating graphene/Cu composites via in-situ synthesized technologies. It examines various in-situ growth strategies, including chemical vapor deposition and solid-state carbon source thermal annealing, used to synthetize graphene directly on or within copper matrices. The processing routes for integrating graphene into copper, like powder metallurgy, electrochemical deposition, accumulative roll bonding, are evaluated. Moreover, the review summarizes and discusses different microstructural architectures, including homogeneous, laminate, and network structures, and assesses their respective contribution to mechanical and functional performances. The interface response between graphene and the Cu matrix are critically analyzed based on recent experimental and theoretical investigations.【Result】 The in-situ growth of graphene on Cu enables strong interfacial bonding and uniform dispersion, which significantly enhances the mechanical/physical properties(such as strength, hardness, and wear resistance) of Cu without substantially compromising its electrical and thermal conductivity. The architecture of graphene reinforced Cu matrix composites plays a important role in property regulation: homogeneous structures improve strength/stiff but often leads to a decrease in ductility and conductivity; laminate designs enhance anisotropic strength and toughness, meanwhile ensures the conductivity performance; three-dimensional network architectures optimize both load transfer and conductive pathways, readily achieving an overall performance improvement. Furthermore, graphene incorporation improves corrosion resistance and thermal stability of the Cu nanocomposites. The in-situ Gr/Cu interface, often characterized by semi-coherent bonding, is crucial for stress/strain transfer and redistribution, and electron/phonon transport. However, challenges remain in controlling graphene layer number, alignment, and interfacial reactions in in-situ graphene-Cu system.【Conclusion】 In-situ graphene/Cu composites represent a promising route to overcome the performance limits of pure copper, offering a synergistic combination of enhanced mechanical properties, retained/improved high conductivity, and increasing corrosion resistance. The successful implementation of these composites depends largely on the precise control of graphene growth, architectural design, and interfacial bonding. Future development should focus on scalable and cost-effective in-situ fabrication Gr techniques, advanced microstructural tailoring, and a deeper understanding of mechanical and physical behaviors. With progressive development, in-situ graphene reinforced Cu composites are expected to enable high-performance and multifunctional applications in next-generation electronics, thermal management systems, and advanced electrical machinery.