倒角结晶器铜板传热及冷却水流动耦合数值模拟
刘启龙, 陶红标, 董建锋, 曹成虎, 陆强, 罗霄, 李雄杰
Coupled numerical simulation on heat transfer and cooling water flow of chamfered mold copper plates
LIU Qilong, TAO Hongbiao, DONG Jianfeng, CAO Chenghu, LU Qiang, LUO Xiao, LI Xiongjie
连铸
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2026, (3): 82
-87
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DOI: 10.13228/j.boyuan.issn1005-4006.20250136
