Characterization of mechanical properties of through silicon vias-copper nanoindentation with different diameter
ZHANG Zhuohao, QIN Fei, WU Daowei, LI Kui, DAI Yanwei
Physics Examination and Testing . 2025, (6): 78 -82 .  DOI: 10.13228/j.boyuan.issn1001-0777.20250076