倒角结晶器铜板传热及冷却水流动耦合数值模拟
Coupled numerical simulation on heat transfer and cooling water flow of chamfered mold copper plates
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摘要: 本文依据结晶器铜板与背板实际几何尺寸建立物理模型,同步构建结晶器铜板三维传热及冷却水流动数学模型,对直角及倒角结晶器窄面铜板传热及冷却水流动进行耦合数值模拟。结果表明,在冷却水总流量均为510 L/min时,直角及倒角结晶器宏观平均水速分别为8.8 m/s和7.4 m/s;靠近倒角结晶器铜板边角处的圆孔内水速仅为4.8~5.1 m/s,而直角结晶器靠近边部水缝的水速基本稳定在8 m/s以上;在弯月面区域,直角及倒角结晶器窄面铜板角部温度分别为677 K和763 K;将倒角区铜板进水口圆孔直径由10 mm扩大至14 mm,结晶器窄面水量提升至540 L/min后,边部圆孔水速可提高到6 m/s,有利于提高倒角结晶器角部的冷却强度。Abstract: Based on actual dimensions of the copper plate and the back plate, a physical model was constructed. Meanwhile, a three-dimensional heat transfer and cooling water flow mathematical model of the copper plate of the mold was established. Coupled numerical simulations were conducted on the heat transfer and cooling water flow of the narrow-face copper plates of the right-angle and chamfered mold. The results show that when the water volume is 510 L/min, the macroscopic average water velocity of the right-angle and chamfered mold are 8.8 m/s and 7.4 m/s, respectively. The water velocity in the circular holes near the corner of the copper plate of the chamfered mold is only 4.8 m/s to 5.1 m/s, while the water velocity in the water gap near the edge of the right-angle mold reaches more than 8 m/s. In the meniscus area, the corner temperatures of the narrow copper plates of the right-angle and chamfered molds reached 677 K and 763 K respectively. When the diameter of the circular hole at the water inlet of the copper plate in the chamfered area is increased from 10 mm to 14 mm and the water volume on the narrow side of the mold is increased to 540 L/min, the water velocity at the edge circular hole can be raised to 6 m/s, which is conducive to enhancing the cooling intensity at the corner of the chamfered mold.
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