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累积叠轧制备CoCrNi极薄带及其组织结构演化

Accumulative roll bonding for CoCrNi medium-entropy alloy ultra-thin strips and its microstructure evolution

  • 摘要: 本文以CoCrNi中熵合金为研究对象,针对其极薄带制备与性能调控难题,采用累积叠轧工艺突破传统轧制极限,成功制备出厚度为0.10~0.27 mm的极薄带。研究表明,随着厚度减薄,晶粒沿轧制方向显著拉长,位错密度及亚结构比例同步增加,致使材料强度升高、塑性下降;其中0.10 mm厚极薄带的抗拉强度达1 295 MPa,伸长率仅为2.5%。为优化其综合性能,进一步开展750 ℃退火处理实验。结果表明,短时退火(5~15 min)以再结晶为主导机制,可获得抗拉强度约为950 MPa、伸长率约为35%的平衡性能;延长保温时间至30 min后,材料内部回复作用增强,亚晶与变形晶占比升至48.6%,虽因晶粒粗化使强度略增至1 001 MPa,但伸长率显著下降至22.2%。研究结果揭示了CoCrNi中熵合金极薄带微观结构演变与力学性能的关联规律,为其作为高性能微纳器件用超薄金属材料的应用提供了重要的理论依据与技术支撑。

     

    Abstract: Focusing on CoCrNi medium-entropy alloy (MEA) and addressing challenges in fabricating and regulating the performance of its ultra-thin strips, this study employed the accumulative roll bonding (ARB) process to overcome conventional rolling limits, successfully producing ultra-thin strips with thicknesses of 0.1-0.27 mm. It was found that with decreasing thickness, grains elongated significantly along the rolling direction, accompanied by synchronous increases in dislocation density and substructure fraction, leading to enhanced strength but reduced plasticity. Specifically, the 0.1 mm strip exhibited a tensile strength of 1 295 MPa and an elongation of merely 2.5%. To optimize comprehensive performance, 750 ℃ annealing treament was further conducted:short-time annealing (5-15 min) is dominated by recrystallization as the primary mechanism, resulting in balanced properties with a tensile strength of approximately 950 MPa and an elongation rate of about 35%. Prolonged holding time to 30 min enhanced internal recovery, increasing the fraction of subgrains and deformed grains to 48.6%; although grain coarsening slightly raised strength to 1 001 MPa, plasticity significantly decreased to 22.2%. This study revealed the correlation between microstructural evolution and mechanical properties of CoCrNi MEA ultra-thin strips, providing important theoretical basis and technical support for their application as ultra-thin metallic materials in high-performance micro/nano devices.

     

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