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铜渣包缓冷过程液固相变行为特性数值模拟

Numerical simulation of liquid-solid phase transition behavior in copper slag ladle during slow cooling

  • 摘要: 铜渣包缓冷过程中, 液固相变温度区的铜渣降温速率是影响后续浮选的关键因素之一。为分析现有缓冷制度下渣包内不同位置铜渣的液固相变行为特性, 本文以某厂12 m3铸造渣包为研究对象, 基于有限体积法构建了三维非稳态数值传热模型, 模拟分析了现有缓冷制度下铜渣的液相降温速率及结壳规律, 并进一步探究了空冷时长变化对缓冷过程的影响。结果表明, 铜渣在缓冷过程中, 受已形成渣壳的热阻作用及液固相变潜热释放的共同影响, 其内部降温速率呈现显著的空间非均匀性, 靠近渣包内壁的铜渣液相降温速率相对较快, 主要发生在空冷前3 h, 其体积占比不足1/3;其余区域降温速率明显较低, 普遍低于1 K/min。随着空冷时长的延长, 铜渣结壳持续增厚, 在空冷12 h后每延长2 h结壳厚度增加约20 mm, 有效降低了铜渣转入水冷阶段的"放炮"风险。然而, 随着结壳不断增厚, 其热阻进一步增强, 使得水冷阶段对铜渣内部降温速率的促进作用有限, 反而延长了铜渣完全凝固所需时间。研究结果可为铜渣包缓冷制度的优化及渣包结构、材料的改进提供理论参考。

     

    Abstract: During the slow cooling process of copper slag in the ladle, the cooling rate of copper slag in the liquid-solid phase transition temperature range is one of the key factors affecting the subsequent flotation. To analyze the liquid-solid phase transition behavior characteristics of copper slag at different positions in the slag ladle under the existing slow cooling system, this paper took a 12 m3 cast steel slag ladle from a certain factory as the research object, constructed a three-dimensional unsteady numerical heat transfer model based on the finite volume method, simulated and analyzed the liquid phase cooling rate and crust formation law of copper slag under the existing slow cooling system, and further explored the influence of air cooling duration change on the slow cooling process. The results show that during the slow cooling process of copper slag, affected by the combined action of the thermal resistance of the formed slag crust and the release of latent heat of liquid-solid phase transition, the internal cooling rate presents significant spatial inhomogeneity. The liquid phase cooling rate of copper slag near the inner wall of the slag ladle is relatively fast, which mainly occurs in the first 3 h of air cooling, and its volume accounts for less than 1/3; the cooling rate of the remaining areas is significantly lower, generally below 1 K/min. With the extension of air cooling duration, the copper slag crust continues to thicken; after 12 h of air cooling, the crust thickness increases by about 20 mm for every additional 2 h, which effectively reduces the "explosion" risk when copper slag is transferred to the water cooling stage. However, with the continuous thickening of the crust, its thermal resistance is further enhanced, which makes the promotion effect of the water cooling stage on the internal cooling rate of copper slag limited, and on the contrary, prolongs the time required for the complete solidification of copper slag. The research results can provide a theoretical reference for the optimization of the slow cooling system of copper slag ladles and the improvement of slag ladle structure and materials.

     

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