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PHYSICS EXAMINATION AND TESTING  2021, Vol. 39 Issue (5): 9-    DOI: 10.13228/j.boyuan.issn10010777.20210001
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Numerical analysis on thermal compression of #br# sample used in a thermal simulation testing machine
XIE Zhengjun 1,FAN Tian 2,XIE Jianbo 2
1. School of Materials Science and Engineering, Southwest University of Science and
Technology, Mianyang 621000, China;2. School of Materials Science and Engineering,
 Shanghai University, Shanghai 200444, China

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