Coupled numerical simulation on heat transfer and cooling water flow of chamfered mold copper plates

LIU Qilong, TAO Hongbiao, DONG Jianfeng, CAO Chenghu, LU Qiang, LUO Xiao, LI Xiongjie

Continuous Casting ›› 2026, Vol. 45 ›› Issue (3) : 82-87.

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Continuous Casting ›› 2026, Vol. 45 ›› Issue (3) : 82-87. DOI: 10.13228/j.boyuan.issn1005-4006.20250136
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Coupled numerical simulation on heat transfer and cooling water flow of chamfered mold copper plates

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2026, 45(3): 82-87 https://doi.org/10.13228/j.boyuan.issn1005-4006.20250136

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Started in 1982 (Bimonthly)
ISSN 1005-4006　CN 11-3385/TG
Manager: China Association for Science and Technology
Sponsor: The Chinese Society for Metals
CISRI Boyuan Publishing Co., Ltd.
Editor-in-Chief: BAO Yanping
Editor and Publisher: CISRI Boyuan Publishing Co., Ltd.
Domestic Distribution: Beijing Newspapers and Periodicals Distribution Bureau, China Post Group Co., Ltd. (No.82-441)
CISRI Boyuan Publishing Co., Ltd.
Address: No.76 Xueyuan Nanlu, Haidiann Beijing 100081, China
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